About
WHO ARE WE?
Located in Besançon, in the heart of the microtechnology basin, Xtalab specializes in the processing and shaping of smart materials from semiconductor activities.
With nearly 10 years of expertise in the piezoelectric, telecommunications and micromechanics fields, we respond quickly to all your requests for specific cutting of wafers and substrates for all materials and we support you in the development or improvement of your products.
Our expertise in the field of shaping intelligent materials has enabled us to take part in many innovative development projects with the largest players in the microtechnology and watchmaking fields.
OUR EQUIPMENTS
High precision wafers & substrates dicing
Average treatment within 4 days
LOADPOINT MICROACE SERIE 3
- Wafers all materials: Silicon – Glass – Quartz – Ceramics – Metals – Semiconductors – Niobates
- Maximum wafer size: 4 inches
- Maximum dimensions of substrates: 100mm x 100mm
- Maximum cutting thickness: 5mm
- Dicing on plan
Lapping – Polishing
– SOMOS TOWER
– LAMPLAN M.M. 8400
- Polishing all materials
- Trays up to 40cm
- Wafers, substrates, optical fibers
- Controlled thinning up to 100µm
- Polishing specific bevels
Protection and cleaning
CHEMISTRY AREA
- Laminar flow hood
- Ultrasonic baths
- Tournette
- Vacuuming
- Film protection
Electronics and controls
– ELECTRONIC WORKSHOP
- Measuring benches
- Digital oscilloscopes
- Microscopes and Binoculars
- Micro-assembly workshop