Wafers and substrates dicing
YOUR CUT PROCEED IN 4 DAYS
Upon confirmation of feasibility, we ensure rapid processing of your cutting needs.
Our equipment offers great flexibility in our cutting capabilities, from simple cutting of glass substrate to cutting of resin-protected composite wafers.
Standard wafers
Cutting of standard wafers in Silicon, Glass, Quartz, Niobate, or others according to the needs.
Composite wafers
Cutting of specific, composite wafers of non-standard thicknesses with or without protection.
Other substrates
Precision dicing of materials from all formats within the limits of the accepted dimensions.
DIMENSIONS AND CHARACTERISTICS OF CUTTINGS
Discover the cutting parameters accepted by our equipment.
Materials treated: Silicon, Glasses, Piezoelectric ceramics, Quartz, Niobates, Composites, others on request
For your most sensitive cuts, we also offer the deposition of a protective resin coating with a spinner.
Wafers dicing
For your needs for cutting components, chips or others using standard wafer formats.
- Maximum dimensions: 4 inches
- Maximum thickness: 5mm
- Cutting lines: from 40µm to 400µm
Other substrates dicing
Perfectly suited for cutting Glass-Chrome masks for example, our equipment can be used to produce all types of components.
- Maximum dimensions: 100×100 mm
- Maximum thickness: 5mm
- Glass wedges, Optical polarizers, Encapsulation boxes
